| 摘要 |
PROBLEM TO BE SOLVED: To downsize a semiconductor device, and to provide a technique capable of improving the processability of a jacket.SOLUTION: A semiconductor device comprises: a semiconductor element 1; a base plate 2 having an upper surface on which the semiconductor element 1 is mounted; a cooling fin 3 disposed on a lower surface of the base plate 2; a jacket 4 which is sealed and disposed surrounding the cooling fin 3 on the lower surface of the base plate 2; and a header partition wall 7 which is formed separately from the jacket 4 and fixed to the jacket 4 under the cooling fin 3 within the jacket 4 and which forms a header 5 and a passage 6 for passing a refrigerant through the cooling fin 3. |
