RECORDING ELEMENT SUBSTRATE, METHOD OF MANUFACTURING THE SAME, RECORDING HEAD, AND RECORDING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique advantageous in improving reliability of a recording element substrate while reducing a chip area of the recording element substrate.SOLUTION: A method of manufacturing a recording element substrate includes the steps of: preparing a substrate which includes a first region and a second region different from the first region, includes a recording part which is formed on the first region and records by supplying heat energy to a liquid, and includes a wiring pattern which is formed on the first region and the second region and is electrically connected to the recording part; forming an insulating film which is formed on the first region and the second region and covers the recording part and the wiring pattern; and forming a conductive cavitation resistant film on the insulating film by forming a conductive member on the insulating film and removing a part formed on at least the second region out of the conductive member. In the step of forming the insulating film, the insulating film is formed so that a side surface of a part formed on the second region out of the insulating film includes an inclined surface.