| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a through-hole in a glass substrate in which necking is hard to occur in a through-hole, and a ring-shaped protrusion is hard to occur around an opening of a through-hole after processing.SOLUTION: A discharge auxiliary-type laser aperture processing method has: (1) a step of adhering resin film having an adhesive layer on a surface of a glass substrate; (2) a step of irradiating the glass substrate with laser light from the resin film side and forming a through-hole on the glass substrate; (3) a step of generating electric discharge via the through-hole after the through-hole is formed and until an operation of stopping the laser light irradiation is performed; (4) a step of reducing adhesive force of the adhesive layer by irradiating the adhesive layer with ultraviolet light or wetting the adhesive layer after the laser light irradiation is stopped; and (5) a step of peeling the resin film having the adhesive layer off from the glass substrate. |
