| 发明名称 |
Surface-Treated Copper Foil |
| 摘要 |
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications. |
| 申请公布号 |
US2015079415(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201314388838 |
申请日期 |
2013.03.29 |
| 申请人 |
JX Nippon Mining & Metals Corporation |
发明人 |
Fukuchi Ryo |
| 分类号 |
H05K1/09;H05K1/03;H05K1/02 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface-treated copper foil, wherein the amount of adhesion of Si on a copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on a copper foil surface is from 2.5 to 690 μg/dm2. |
| 地址 |
Tokyo JP |
