Adjustable Semiconductor Processing Device And Control Method Thereof

摘要

Disclosed is an adjustable semiconductor processing apparatus and a control method thereof. The apparatus comprises a micro chamber with an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface that are relatively moveable towards each other between an open position and a closed position. When the chamber is in the closed position, a cavity formed by the upper working surface and the lower working surface defines a gap between the upper working surface, the lower working surface and a semiconductor wafer received in the cavity for flow of a processing fluid. A drive device enables the upper working surface of the upper chamber portion or/and the lower working surface of the lower chamber portion to tilt or deform to control flow of chemical agents within the micro chamber.

主权项

1. A semiconductor processing apparatus, comprising:
a drive device comprising a plurality of drive units; and a micro chamber configured to receive and process a semiconductor wafer, the micro chamber comprising:
an upper chamber portion defining an upper working surface;a lower chamber portion defining a lower working surface;at least one inlet configured to direct a processing fluid to flow into the micro chamber; andat least one outlet configured to direct the processing fluid to flow out of the micro chamber, wherein the upper chamber portion and the lower chamber portion are relatively moveable towards each other between an open position and a closed position of the micro chamber, wherein when the micro chamber is in the closed position, the upper working surface and the lower working surface form a cavity configured to receive the semiconductor wafer, and a narrow gap is formed among the upper working surface, the lower working surface, wherein an upper part of the upper chamber portion or a lower part of the lower chamber is connected to the drive device or a lower part of the lower chamber portion is connected to the drive device, and wherein the drive device is configured to drive the micro chamber to different positions.