TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING SAME

摘要

A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.

主权项

1. A one glass solution touch screen panel comprising:
a substrate with a top surface; a shielding layer formed on a first portion of the substrate, and having a top shielding layer surface opposite to and substantially parallel to the substrate top surface; an indium tin oxide film layer formed on a second portion of the substrate top surface, the indium tin oxide film layer having a top indium tin oxide film surface opposite to, and substantially parallel to the substrate, and including a plurality of indium tin oxide film connecting portions; a soft circuit board formed on a portion of the top shielding layer surface; an infiltrate layer formed on a portion of the top indium tin oxide film surface of the plurality of indium tin oxide connecting portions and on a portion of the top shielding layer surface, the infiltrate layer having a top infiltrate layer surface opposite to, and substantially parallel to, the top indium tin oxide film surface, and defining a plurality of infiltrate gaps within the infiltrate layer; and a plurality of conducting connectors formed on the top infiltrate layer surface; wherein, the plurality of the conducting connectors is electrically connected to the soft circuit board; wherein, a portion of the plurality of the conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions of the indium tin oxide layer; and wherein, the portion of the plurality of the conducting connectors extending into the infiltrate layer and connecting to the indium tin oxide layer improves adherence of the conducting connectors to the indium tin oxide later.