| 发明名称 |
ALIGNMENT MARK STRUCTURE |
| 摘要 |
A conductive structure includes a wafer having a scribe line defined thereon, at least a first wiring layer formed in the scribe line, and at least a via layer disposed in the scribe line and under the wiring layer. The first wiring layer includes a main pattern and the via layer includes a closed frame pattern corresponding to the main pattern of the first wiring layer. |
| 申请公布号 |
US2015076665(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201314029815 |
申请日期 |
2013.09.18 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Shiu Jian-Bin;Chen Min-Ching |
| 分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive structure comprising:
a wafer having a scribe line defined thereon; at least a first wiring layer formed in the scribe line, the first wiring layer comprising a main pattern; and at least a via layer formed in the scribe line and under the wiring layer, the via layer comprising a closed frame pattern corresponding to the main pattern of the first wiring layer. |
| 地址 |
Hsin-Chu City TW |
