SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To restrain an adhesive material applied on a substrate from spreading thereby to improve accuracy of a coating region of the adhesive material.SOLUTION: A semiconductor device manufacturing method of an embodiment comprises the steps of: preparing a substrate 10 where a dent 26 is formed on a surface; mounting a first semiconductor chip 30 on the substrate 10 so as to expose at least a part of the dent 26; supplying a liquid or paste-like adhesive material 38 to the dent 26 of the substrate 10; and subsequently mounting a second semiconductor chip 40 on the first semiconductor chip 30 in a manner such that a part of the second semiconductor chip 40 hangs over the first semiconductor chip 30 and a projection 41 opposite to the dent 26 is formed. As a result, the second semiconductor chip 40 is fixed by the adhesive material 38.