| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can maintain efficiency of heat discharge at the time of driving while enabling inhibition of a residual stress on a semiconductor chip, which occurs at the time of manufacture.SOLUTION: A semiconductor device 1 according to the present embodiment comprises a semiconductor chip 2, a sub-mount 3 on which the semiconductor chip 2 is mounted and a bonded body 5 bonded to at least a part of a side part of the sub-mount 3. In the case where a linear thermal expansion coefficient of the sub-mount 3 is larger than a linear thermal expansion coefficient of the semiconductor chip 2, a linear thermal expansion coefficient of the bonded body 5 is smaller than a linear thermal expansion coefficient of the sub-mount 3. On the other hand, in the case where the linear thermal expansion coefficient of the sub-mount 3 is smaller than the linear thermal expansion coefficient of the semiconductor chip 2, the linear thermal expansion coefficient of the bonded body 5 is larger than the linear thermal expansion coefficient of the sub-mount 3.</p> |
