发明名称 METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR SUBSTRATE, AND COMPOUND SEMICONDUCTOR SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a compound semiconductor substrate which can easily form a compound semiconductor layer containing a GaAs layer that is excellent in crystallinity and flatness of a surface, on an Si substrate; and to provide the compound semiconductor substrate.SOLUTION: In a method for manufacturing a compound semiconductor substrate formed by sequentially stacking a first compound semiconductor layer, a second compound semiconductor layer and a third compound semiconductor layer on an Si substrate, a step of forming the second compound semiconductor layer is a step of simultaneously emitting a Ga material, an As material and an Sb material onto the first compound semiconductor layer. A ratio of a molecular beam intensity of the Sb material to a molecular beam intensity of the Ga material, which is necessary for setting a formation speed of the second compound semiconductor layer at 1μm per one hour, is 1 or more.</p>
申请公布号 JP2015053386(A) 申请公布日期 2015.03.19
申请号 JP20130185361 申请日期 2013.09.06
申请人 ASAHI KASEI CORP 发明人 TOGA HIROTAKA;MOROHARA TADASHI
分类号 H01L21/203;C23C14/06;C23C16/30;H01L21/205 主分类号 H01L21/203
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