发明名称 Substrate Processing System with Multiple Processing Devices Deployed in Shared Ambient Environment and Associated Methods
摘要 A plurality of substrate processing devices are disposed in a separated manner within a shared ambient environment. A conveyance device is disposed within the shared ambient environment and is defined to move a substrate through and between each of the substrate processing devices in a continuous manner. Some substrate processing devices are defined to perform dry substrate processing operations in which an energized reactive environment is created in exposure to the substrate in an absence of liquid material. Some substrate processing devices are defined to perform wet substrate processing operations in which at least one material in a liquid state is applied to the substrate. In one embodiment, a complementary pair of dry and wet substrate processing devices are disposed in the shared ambient environment in a sequential manner relative to movement of the substrate by the conveyance device.
申请公布号 US2015079795(A1) 申请公布日期 2015.03.19
申请号 US201414548089 申请日期 2014.11.19
申请人 Lam Research Corporation 发明人 Hemker David J.;Sheet Lubab L.;Marks Jeffrey
分类号 H01L21/3065;H01L21/306;H01L21/308 主分类号 H01L21/3065
代理机构 代理人
主权项 1. A method for processing a substrate, comprising: moving the substrate in a sequential manner through a plurality of substrate processing devices disposed in a separated manner within a shared ambient environment, wherein moving the substrate through a given substrate processing device subjects the substrate to a processing operation performed by the given substrate processing device, and wherein some of the plurality of substrate processing devices operate to perform a dry substrate processing operation, and wherein some of the plurality of substrate processing devices operate to perform a wet substrate processing operation, wherein the dry substrate processing operation does not apply any material in a liquid state to the substrate, and wherein the wet substrate processing operation does apply at least one material in a liquid state to the substrate.
地址 Fremont CA US