| 发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
| 摘要 |
When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2. |
| 申请公布号 |
US2015079708(A1) |
申请公布日期 |
2015.03.19 |
| 申请号 |
US201214385970 |
申请日期 |
2012.03.27 |
| 申请人 |
Sugahara Jun;Ohazawa Hidetaka;Tanaka Shinsuke;Nara Hiromu;Tan Hiroki |
发明人 |
Sugahara Jun;Ohazawa Hidetaka;Tanaka Shinsuke;Nara Hiromu;Tan Hiroki |
| 分类号 |
H01L51/56;B05D1/26;C23C16/455 |
主分类号 |
H01L51/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an electronic device comprising:
a step of coating a substrate partially with a partially coating member; a step of forming an element on said substrate; a step of forming a coating film on said substrate to cover said element and said partially coating member; and a step of forming a crack in said coating film on said partially coating member. |
| 地址 |
Yonezawa-shi JP |
