SYSTEM-IN-PACKAGES CONTAINING EMBEDDED SURFACE MOUNT DEVICES AND METHODS FOR THE FABRICATION THEREOF

摘要

Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing one or more frontside redistribution layers over a molded panel having a backside and an opposing frontside through which a semiconductor die and a first Surface Mount Device (SMD) are exposed. Material is removed from the backside of the molded panel to expose the first SMD therethrough. A contact array is formed over the frontside of the molded panel and electrically coupled to the semiconductor die and to the first SMD through the frontside redistribution layers. The molded panel is singulated to produce a SiP having a molded body in which the semiconductor die and the first SMD are embedded and through which the first SMD extends.

主权项

1. A method for fabricating a System-in-Package (SiP), comprising:
producing one or more frontside redistribution layers over a molded panel having a backside and an opposing frontside through which a semiconductor die and a first Surface Mount Device (SMD) are exposed; removing material from the backside of the molded panel to expose the first SMD therethrough; forming a contact array over the frontside of the molded panel electrically coupled to the semiconductor die and to the first SMD through the frontside redistribution layers; and singulating the molded panel to produce a SiP having a molded body in which the semiconductor die and the first SMD are embedded and through which the first SMD extends.