SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

摘要

Certain embodiments provide a semiconductor package including a base metal portion, a frame body, a plurality of wires, and a lid body. The base metal portion includes multiple grooves on a back surface, and can mount a semiconductor chip on a front surface. The frame body is arranged on the front surface of the base metal portion. The plurality of wires are arranged to penetrate through a side surface of the frame body. The lid body is arranged on the frame body.

主权项

1. A semiconductor package comprising:
a base metal portion including a plurality of grooves on a back surface, and capable of mounting a semiconductor chip on a front surface; a frame body arranged on the front surface of the base metal portion; a plurality of wires arranged to penetrate through a side surface of the frame body; and a lid body arranged on the frame body.