METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MANUFACTURING A CHIP ASSEMBLY AND CHIP ASSEMBLY

摘要

A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first side and a second side opposite the first side, with its second side to an electrically conductive carrier. An insulating layer is formed over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip. At least one second chip is arranged over the insulating layer. An encapsulating material is formed over the first chip and the second chip. Electrical contacts are formed through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.

主权项

1. A method of manufacturing a chip package, the method comprising:
electrically contacting at least one first chip, the first chip comprising a first side and a second side opposite the first side, with its second side to an electrically conductive carrier; forming an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; arranging at least one second chip over the insulating layer; forming encapsulating material over the first chip and the second chip; and forming electrical contacts through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.