发明名称 METHOD OF INTEGRATING SELECT GATE SOURCE AND MEMORY HOLE FOR THREE-DIMENSIONAL NON-VOLATILE MEMORY DEVICE
摘要 A method of fabricating a semiconductor device, such as a three-dimensional NAND memory string, includes forming a carbon etch stop layer having a first width over a major surface of a substrate, forming a stack of alternating material layers over the etch stop layer, etching the stack to the etch stop layer to form a memory opening having a second width at a bottom of the memory opening that is smaller than the width of the etch stop layer, removing the etch stop layer to provide a void area having a larger width than the second width of the memory opening, forming a memory film over a sidewall of the memory opening and in the void area, and forming a semiconductor channel in the memory opening such that the memory film is located between the semiconductor channel and the sidewall of the memory opening.
申请公布号 US2015076580(A1) 申请公布日期 2015.03.19
申请号 US201414341079 申请日期 2014.07.25
申请人 SanDisk Technologies, Inc. 发明人 PACHAMUTHU Jayavel;ALSMEIER Johann;CHIEN Henry
分类号 H01L27/115 主分类号 H01L27/115
代理机构 代理人
主权项 1. A method of fabricating a memory device, comprising: forming a carbon etch stop layer having a first width dimension over a major surface of a substrate; forming a stack of alternating layers of a first material and a second material different from the first material over the carbon etch stop layer; etching the stack through a mask to the carbon etch stop layer to form a memory opening having a second width dimension at a bottom of the memory opening proximate to the carbon etch stop layer that is smaller than the first width dimension of the carbon etch stop layer; removing the carbon etch stop layer to provide a void area between the bottom of the memory opening and a top surface of a protrusion comprising a semiconductor material, the void area having a larger width dimension than the second width dimension of the memory opening; forming at least a portion of a memory film over a sidewall of the memory opening and in the void area; and forming a semiconductor channel in the memory opening such that the memory film is located between the semiconductor channel and the sidewall of the memory opening.
地址 Plano TX US