发明名称 |
METHOD OF INTEGRATING SELECT GATE SOURCE AND MEMORY HOLE FOR THREE-DIMENSIONAL NON-VOLATILE MEMORY DEVICE |
摘要 |
A method of fabricating a semiconductor device, such as a three-dimensional NAND memory string, includes forming a carbon etch stop layer having a first width over a major surface of a substrate, forming a stack of alternating material layers over the etch stop layer, etching the stack to the etch stop layer to form a memory opening having a second width at a bottom of the memory opening that is smaller than the width of the etch stop layer, removing the etch stop layer to provide a void area having a larger width than the second width of the memory opening, forming a memory film over a sidewall of the memory opening and in the void area, and forming a semiconductor channel in the memory opening such that the memory film is located between the semiconductor channel and the sidewall of the memory opening. |
申请公布号 |
US2015076580(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201414341079 |
申请日期 |
2014.07.25 |
申请人 |
SanDisk Technologies, Inc. |
发明人 |
PACHAMUTHU Jayavel;ALSMEIER Johann;CHIEN Henry |
分类号 |
H01L27/115 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A method of fabricating a memory device, comprising:
forming a carbon etch stop layer having a first width dimension over a major surface of a substrate; forming a stack of alternating layers of a first material and a second material different from the first material over the carbon etch stop layer; etching the stack through a mask to the carbon etch stop layer to form a memory opening having a second width dimension at a bottom of the memory opening proximate to the carbon etch stop layer that is smaller than the first width dimension of the carbon etch stop layer; removing the carbon etch stop layer to provide a void area between the bottom of the memory opening and a top surface of a protrusion comprising a semiconductor material, the void area having a larger width dimension than the second width dimension of the memory opening; forming at least a portion of a memory film over a sidewall of the memory opening and in the void area; and forming a semiconductor channel in the memory opening such that the memory film is located between the semiconductor channel and the sidewall of the memory opening. |
地址 |
Plano TX US |