CIRCUIT DEVICE

摘要

A circuit device provided with: a metal substrate having a metal plate, an insulation layer provided on one surface of the metal plate, and a conductor pattern provided on the insulation layer; and a plate-shaped bus bar provided on the insulation layer and the conductor pattern. The bus bar has a first surface facing the metal substrate and a second surface opposite the first surface. The first surface has a contact part in contact with the metal substrate, and a separated part which is at least a part of a surface positioned between the contact part and the second surface and which is separated from the metal substrate.