| 摘要 |
PROBLEM TO BE SOLVED: To provide a dynamic quantity sensor capable of suppressing displacement of a thin film part due to stress generated when a first substrate and a second substrate are bonded.SOLUTION: In a dynamic quantity sensor, a hollow part 20c has such a shape that at least a part of a first projection line P1, with which the opening end of the hollow part 20c is projected on one surface 10a of a first substrate 10, is positioned outside of a second projection line P2, with which the boundary line between the side wall of a recess part 15 and a thin wall part 15a is projected on the one surface 10a of the first substrate 10. Then, the dynamic quantity sensor includes: a thin film part 18 that is displaced according to a physical quantity at a portion positioned inside the opening end of the hollow part 20c in the thin wall part 15a; and a stress reduction area 19 that is an area between the thin film part 18 and the portion connected to the opening end of the hollow part 20c. |
