发明名称 MANUFACTURING DEVICE AND MANUFACTURING METHOD OF POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing device and a manufacturing method of a polishing pad which reduce variation of thickness of polishing pads manufactured.SOLUTION: A polishing pad manufacturing device, in which a resin block is sliced in the horizontal direction to manufacture a polishing pad, comprises a loading pedestal on which the resin block is loaded, a slice blade 3 which slice-processes a surface layer of the resin block loaded on the loading pedestal, and a pressing roller 4 which is provided apart by a spacing of a prescribed period in the front side from a blade tip 31 of the slice blade 3 and is disposed at the upper surface of the resin block. The surface layer of the resin block is slice-processed, by moving relatively the resin block, the slice blade 3 and the pressing roller 4.
申请公布号 JP2015051489(A) 申请公布日期 2015.03.19
申请号 JP20130186400 申请日期 2013.09.09
申请人 FUJIBO HOLDINGS INC 发明人 MATSUZAWA HIRONOBU;MATSUZAWA HIDEKI;WATANABE HIROO;MAEFUJI KEISUKE
分类号 B24B37/24;B24D11/00;B26D3/00;B26D3/28 主分类号 B24B37/24
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