发明名称 POROUS MATERIAL, HONEYCOMB STRUCTURE AND HONEYCOMB FILTER
摘要 PROBLEM TO BE SOLVED: To provide a porous material having excellent thermal shock resistance.SOLUTION: There is provided a porous material which comprises aggregates and a bonding material for bonding aggregates in a state of forming pores between the aggregates, where the aggregates contains silicon carbide particles or silicon nitride particles, the bonding material is composed mainly of TiSiC, the ratio of the mass of the binding material is 1 to 50 mass% based on the total mass of the aggregates and the binding material, the porosity preferably is 25 to 70%, pores having a pore diameter of less than 10 μm are 20% or less of the whole pore and pores having a pore diameter of more than 40 μm are 10% or less of the whole pore.
申请公布号 JP2015051899(A) 申请公布日期 2015.03.19
申请号 JP20130185596 申请日期 2013.09.06
申请人 NGK INSULATORS LTD 发明人 KOBAYASHI YOSHIMASA
分类号 C04B38/00;B01D39/20;C04B35/565;C04B35/584 主分类号 C04B38/00
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