| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit module having a high shield effect and suitable for reduction of height, and to provide a manufacturing method of the circuit module.SOLUTION: A circuit module comprises a circuit board, a mounted component, a sealing body, and a shield. The circuit board has a mounting surface and the mounted component is mounted on the mounting surface. The sealing body is formed on the mounting surface to cover the mounted component and has a first sealing body portion having a first thickness and a second sealing body portion having a second thickness thicker than the first thickness. The shield covering the sealing body has: a first shield portion which is formed on the first sealing body portion and has a third thickness; and a second shield portion which is formed on the second sealing body portion and has a fourth thickness thinner than the third thickness, and in which the total thickness of the second thickness and the fourth thickness is equal to the total thickness of the first thickness and the third thickness.</p> |
