RESIN COMPOSITION, FIRST-SUPPLY TYPE SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a non-epoxy resin composition for a first-supply type process.SOLUTION: A resin composition comprises (A) EO modified bisphenol A dimethacrylate, (B) tricyclodecanedimethanol diacrylate, (C) trimethylolpropane triacrylate, (D) organic peroxide, (E) butadiene and maleic anhydride copolymer, (F) bismaleimide, and (G) silica filler.