SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

摘要

A semiconductor device is characterized in being provided with: a semiconductor module comprising a plurality of cooling fins, and a cooling fin for fixation which is longer than the plurality of cooling fins and for which a screw hole is provided in the distal end thereof; a cooling jacket comprising a refrigerant flow path, which houses the plurality of cooling fins and the cooling fin for fixation, and an aperture formed so that a screw can be inserted into the screw hole; and a screw which is inserted into the screw hole through the aperture, and which fixes the cooling jacket onto the semiconductor module.