| 摘要 |
<p>[Problem] The present invention addresses the problem of providing a polishing composition whereby it becomes possible to reduce the amount of a residual organic material to improve yield in the production of a semiconductor device. [Solution] Provided is a polishing composition which can be used for the polishing of an object of interest, said polishing composition comprising a metal corrosion inhibitor and/or a surfactant, an oxidizing agent and an organic compound, wherein the organic compound has two or three hydroxy groups.</p> |
