| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive with which high conduction reliability is maintained between a circuit board and a chip component and a good adhesion condition between the cured anisotropic conductive adhesive and them is maintained, even when a reliability test including heating of a mounted product, which is obtained by mounting the chip component on the circuit board by using the anisotropic conductive adhesive, is conducted.SOLUTION: When an elastic modulus of a cured product of an anisotropic conductive adhesive which includes conductive particles dispersed in an epoxy-based adhesive, containing an epoxy compound and a curing agent, at 35°C, 55°C, 95°C and 150°C is respectively denoted by EM, EM, EM, and EM, a rate of change of the elastic modulus between 55°C and 95°C is denoted by &Dgr;EM, that between 95°C and 150°C is denoted by &Dgr;EM, mathematical formulas (1)-(5) are satisfied. |
