LAMINATION CHIP ELECTRONIC COMPONENT AND SUBSTRATE FOR MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lamination chip electronic component and a substrate for mounting the same.SOLUTION: A lamination chip electronic component may include: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end parts of the ceramic body in a length direction; first plating layers formed on outer surfaces of the ceramic body while forming the external electrodes; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on the first plating layers excluding the non-conductive layers.