| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a mold resin can absorb moisture in the air thereby to avoid deterioration in semiconductor elements.SOLUTION: A semiconductor device comprises: a lead frame 11 having an island part 28 and terminal parts 281, 282 isolated from the island part 28; a semiconductor chip 12 which is mounted on the island part 28 and has electrodes; an insulation film 15 which is formed on the semiconductor chip 12 and has an opening 16 for exposing at least a part of an electrode 121; and a plate-like connector 13 which covers the electrode 121 exposed by the opening 16 and electrically connects the electrode 121 and the terminal parts 281, 282.</p> |
