POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD

摘要

A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting structure and a pair of semiconductor die disposed on either side of the connecting structure in spaced relationship thereto.

主权项

1. A power semiconductor device package comprising:
a semiconductor die having opposed sides and contacts, a first set of which is disposed on one of said opposed sides and a second set of which is disposed on the remaining side of said opposed sides; and an electrically conductive assembly in mechanical contact with said first set and having an electrically conductive connecting structure, extending away from said first set toward said remaining side and terminating proximate to said second set, wherein said semiconductor die includes an aperture extending between said opposed sides, with said electrically conductive assembly passing through said aperture.