| 摘要 |
The purpose of the present invention is to provide a semiconductor device of a resin-encapsulating structure which can be formed with a relatively low cost and which has high insulation properties, as well as a manufacturing method for the same. In the present invention, a heat spreader (3) comprises a rounded surface (9) or a chamfered surface (29), which is to be a chamfered portion on the outer circumferential portion of the rear face thereof. A plurality of power elements (4) formed as chips are mounted via solder (28) on the surface of the heat spreader (3), andan insulating sheet portion (2) is provided on the rear face side of the heat spreader (3). The insulating sheet portion (2) is formed in a stacked structure of an insulating layer (2a) and a metal foil (2b), wherein the insulating layer (2a) which is provided in the upper layer adheres closely to the rear face of the heat spreader (3). Mold resin (1) is filled in a gap region (S2) between the rounded surface (9) and the insulating sheet portion (2). |
