| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technology for suppressing bending deformation of an insulating plate and making the insulating plate hard to be broken, in a lamination unit which is formed by laminating a semiconductor card and a cooling plate while sandwiching the insulating plate and receives a load in a lamination direction.SOLUTION: A lamination unit prevents an insulating plate arranged between a semiconductor card and a cooling plate from being damaged due to bending with a small radius of curvature on the edge of the semiconductor card. The cooling plate has a recess provided outside in a contact angle between the semiconductor card and the insulating plate. The insulating plate has a portion protruding in a direction toward the recess from the contact angle. The semiconductor card is curved in a direction where an edge in a face which faces the insulating plate and faces the protruding portion of the insulating plate is separated from the insulating plate.</p> |
