SEMICONDUCTOR DEVICE USING A SELF-ASSEMBLY METHOD FOR ITS MANUFACTURING

摘要

A method for manufacturing a semiconductor device according to an embodiment includes making intermediate structural bodies. The shape of an upper and a lower portion of the body are different from each other. The rotational symmetry of the electrode corresponds to that of the semiconductor body. The method includes arranging the intermediate structural bodies to be separated from each other on a tray and vibrating the tray. By causing one of these portions to engage with a recess in an upper surface of a tray the bodies are self-assembled on the tray. The one portion is specially shaped to engage with the recess, while the opposite side does not to engage with the recess. The method includes forming an external electrode connected to an electrode of the intermediate structural body with extends laterally from the body.