| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board.SOLUTION: A build-up printed circuit board of the present invention comprises a core layer, and an insulation layer and a circuit layer, which are superposed on the core layer, so as to expect a reduction in warping. The core layer can include an electronic chip cavity in which an electronic chip is incorporated, and a dummy chip cavity in which a dummy chip is incorporated to cancel the warping caused by the electronic chip. |
