METAL FILING APPARATUS AND METAL FILING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a metal filling apparatus and metal filling method capable of covering an entire surface to be treated with molten metal and reducing dissolved gas in the molten metal as much as possible by sufficiently ensuring fluidity of the molten metal and making uniform flow of the molten metal on the surface to be treated.SOLUTION: A metal filling apparatus 1 includes: a holding table H that holds a semiconductor wafer K in a state that a treatment surface of the semiconductor wafer K is inclined at 90° with respect to a horizontal direction; a cylindrical housing C; a piston P provided movably forward and backward; and the like. The semiconductor wafer K held on the holding table H, the housing C, and the piston P form an airtight treatment chamber 2. This metal filling apparatus 1 further includes: a decompression mechanism 10 reducing pressure inside the treatment chamber 2; a molten metal supply mechanism 15 supplying molten metal M into the treatment chamber 2; degasification mechanism 20 degasifying the molten metal M; and an exciting mechanism 30 applying high-frequency vibration to the molten metal M supplied into the treatment chamber 20.