| 摘要 |
PROBLEM TO BE SOLVED: To enhance the performance of an in-plane angular velocity sensor capable of detecting an angular velocity around an x-axis direction and an angular velocity around a y-axis direction.SOLUTION: A semiconductor chip CHP1 having an angular velocity sensor element formed therein includes a device layer DL and a cap layer CAPL. The device layer DL has, formed therein, a vibrating element 105 capable of vibrating within a zx plane that includes the thickness direction of a support substrate 1S and a detection unit capable of capturing, as a change in capacitance, the displacement in an xy plane perpendicular to the zx plane caused by Coriolis force generated by angular velocity applied around an axis of rotation included in the xy plane. The cap layer CAPL has fixed driving electrodes 106b and 107b that have a voltage applied, the voltage being for causing the vibrating element 105 to vibrate within the zx plane. |
