| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can stably join a metal terminal to a metal pattern on a substrate.SOLUTION: A semiconductor device 1 comprises: a substrate 10 including a metal pattern 14; and a metal terminal 15 connected to the metal pattern 14. The metal terminal 15 includes: a joining part 15a which extends along a surface 14 of the metal pattern 14 and is connected to the metal pattern 14; a support part 15c which extends in a direction different from the extension direction of the joining part 15a; and a terminal bent part 15b which connects the joining part 15a and the support part 15c and linearly extends in a direction different from the extension direction of the joining part 15a and the extension direction of the support part 15c. |
