发明名称 |
FinFET Design Controlling Channel Thickness |
摘要 |
System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate. |
申请公布号 |
US2015079752(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201414541050 |
申请日期 |
2014.11.13 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Zhiqiang;Goto Ken-Ichi;Hsieh Wen-Hsing;Ho Jon-Hsu;Wang Chih-Ching;Huang Ching-Fang |
分类号 |
H01L21/02;H01L29/66 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a semiconductor device, the method comprising:
forming a semiconductor fin on a top surface of a substrate; forming a diffusion barrier layer on a top surface and sidewalls of the semiconductor fin; and forming a capping layer on a top surface and sidewalls of the diffusion barrier layer, the capping layer having a band gap less than a band gap of the semiconductor fin, the diffusion barrier layer having a material composition different than material compositions of both the semiconductor fin and the capping layer. |
地址 |
Hsin-Chu TW |