发明名称 FinFET Design Controlling Channel Thickness
摘要 System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate.
申请公布号 US2015079752(A1) 申请公布日期 2015.03.19
申请号 US201414541050 申请日期 2014.11.13
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Wu Zhiqiang;Goto Ken-Ichi;Hsieh Wen-Hsing;Ho Jon-Hsu;Wang Chih-Ching;Huang Ching-Fang
分类号 H01L21/02;H01L29/66 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method of forming a semiconductor device, the method comprising: forming a semiconductor fin on a top surface of a substrate; forming a diffusion barrier layer on a top surface and sidewalls of the semiconductor fin; and forming a capping layer on a top surface and sidewalls of the diffusion barrier layer, the capping layer having a band gap less than a band gap of the semiconductor fin, the diffusion barrier layer having a material composition different than material compositions of both the semiconductor fin and the capping layer.
地址 Hsin-Chu TW