发明名称 Fracture-Resistant Layered-Substrates and Articles Including the Same
摘要 Embodiments of a layered-substrate comprising a substrate and a layer disposed thereon, wherein the layered-substrate is able to withstand fracture when assembled with a device that is dropped from a height of at least 100 cm onto a drop surface, are disclosed. The layered-substrate may exhibit a hardness of at least about 10 GPa or at least about 20 GPa. The substrate may include an amorphous substrate or a crystalline substrate. Examples of amorphous substrates include glass, which is optionally chemically strengthened. Examples of crystalline substrates include single crystal substrates (e.g. sapphire) and glass ceramics. Articles and/or devices including such layered-substrate and methods for making such devices are also disclosed.
申请公布号 US2015079398(A1) 申请公布日期 2015.03.19
申请号 US201414482250 申请日期 2014.09.10
申请人 CORNING INCORPORATED 发明人 Amin Jaymin;Mayolet Alexandre Michel;Paulson Charles Andrew;Price James Joseph;Reiman Kevin Barry
分类号 C03C17/34;C03C17/22;C01B21/072;C01B21/082;C01B21/068 主分类号 C03C17/34
代理机构 代理人
主权项 1. A layered-substrate comprising: a substrate comprising an outwardly-facing surface; and a layer disposed on the outwardly-facing surface, wherein the layered-substrate exhibits a hardness of at least about 12 GPa, as measured by the Berkovitch Indenter Hardness Test, along an indentation depth of about 100 nm or greater and wherein the layered-substrate is able to withstand fracture when assembled in a device and the device is dropped from a height of at least 100 cm onto a drop surface.
地址 Corning NY US