LIQUID COOLED ELECTRONIC MODULES AND METHODS FOR REPLACING THE SAME

摘要

Embodiments include a liquid cooled electronic device including a compartment configured to enclose an electronic module therein. The compartment includes a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate and a plurality of electrical connectors configured to connect to the electronic module. The electronic module includes a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module. The heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate.

主权项

1. A liquid cooled electronic device comprising:
a compartment configured to enclose an electronic module therein, the compartment comprising: a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate; and a plurality of electrical connectors configured to connect to the electronic module; wherein the electronic module comprises: a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module; and wherein the heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate.