| 摘要 |
PROBLEM TO BE SOLVED: To alleviate stress generated in a substrate caused by pressing-in of an inlay.SOLUTION: There is disclosed a circuit configuration 10 which includes: a circuit board 11 having a conducting path and press-in holes 12A, 12B; inlays 16A, 16B pressed in the press-in holes 12A, 12B; and electronic components 17A, 17B mounted on the circuit board 11. An outer peripheral surface 20 in contact with internal walls of the press-in holes 12A, 12B in the inlays 16A, 16B includes: a high contact pressure part 21 which comes into contact with the internal walls of the press-in holes 12A, 12B to impart pressure to the internal walls; and a low contact pressure part 22 which is provided at a position different from the high contact pressure part 21 in the circumferential direction of the outer peripheral surface 20 and lower than the high contact pressure part 21 in pressure imparted onto the internal walls of the press-in holes 12A, 12B. |
