| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a grinding wheel and a method for processing a wafer, capable of making a processing state of a ring-shaped reinforcement part excellent, in particular, in rough grinding processing when processing the wafer into a concave shape.SOLUTION: A grinding wheel 22 is used in a method for processing a wafer, in which: a rear face of a device region W1 of the wafer W is ground into a concaved shape, the device region having the device region W1 on which a plurality of devices are formed and an outer circumference excessive region W2 surrounding the device region W1; and a ring-shaped reinforcement part WS is formed on a rear face of the outer circumference excessive region W2. The grinding wheel 22 includes a grindstone base 23 and a plurality of grindstones 24 annularly fitted to one edge surface 23a of the grindstone base 23. The grindstones 24 are formed as two layers of first grindstones 24a on the annular outer peripheral side and second grindstones 24b on the inner peripheral side. Grain sizes of abrasive grains contained in the first grindstones 24a on the outer peripheral side are smaller than grain sizes of abrasive grains contained in the second grindstones 24a on the inner peripheral side.</p> |
