发明名称 METHOD OF FORMING A CONDUCTIVE IMAGE USING HIGH SPEED ELECTROLESS PLATING
摘要 A method of producing a conductive image using high speed electroless plating according to the present invention preferably includes the steps of: preparing the surface of a substrate; depositing a metal coordination complex into the surface of the substrate; reducing the metal coordination complex to form an image in the surface of the substrate; depositing a protective material onto the image; electrolessly plating metal onto the image.
申请公布号 US2015079276(A1) 申请公布日期 2015.03.19
申请号 US201414453559 申请日期 2014.08.06
申请人 EARTHONE CIRCUIT TECHNOLOGIES CORPORATION 发明人 Wismann William
分类号 C23C18/16;C03C17/10;C23C18/40 主分类号 C23C18/16
代理机构 代理人
主权项 1. A method of conductive image using high speed electroless plating comprising the steps of: preparing the surface of a substrate, the substrate surface having a thickness; depositing a metal coordination complex within the surface of the substrate; reducing the metal coordination complex to form a metal image in the surface of the substrate; depositing a protective material onto the metal image; and electrolessly plating metal onto the metal image.
地址 Carlsbad CA US