发明名称 |
METHOD OF FORMING A CONDUCTIVE IMAGE USING HIGH SPEED ELECTROLESS PLATING |
摘要 |
A method of producing a conductive image using high speed electroless plating according to the present invention preferably includes the steps of: preparing the surface of a substrate; depositing a metal coordination complex into the surface of the substrate; reducing the metal coordination complex to form an image in the surface of the substrate; depositing a protective material onto the image; electrolessly plating metal onto the image. |
申请公布号 |
US2015079276(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201414453559 |
申请日期 |
2014.08.06 |
申请人 |
EARTHONE CIRCUIT TECHNOLOGIES CORPORATION |
发明人 |
Wismann William |
分类号 |
C23C18/16;C03C17/10;C23C18/40 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
1. A method of conductive image using high speed electroless plating comprising the steps of:
preparing the surface of a substrate, the substrate surface having a thickness; depositing a metal coordination complex within the surface of the substrate; reducing the metal coordination complex to form a metal image in the surface of the substrate; depositing a protective material onto the metal image; and electrolessly plating metal onto the metal image. |
地址 |
Carlsbad CA US |