发明名称 DEPOSITION METHOD OF ELECTRIC RESISTANCE THIN FILM LAYER AND METHOD OF MANUFACTURING COPPER-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a deposition method for enhancing the peel strength of a metal-resin interface, in a thin film having a resistive layer on at least one side of a thermoplastic resin film.SOLUTION: After depositing an electric resistance layer at least on one side of a thermoplastic resin film without interposing an adhesive, electrification heating of the electric resistance thin film layer is performed by feeding a current thereto. Heating is performed so that the electric resistance thin film layer has a temperature between a heating lower limit temperature determined by the glass transition point and a heating upper limit determined by adding 1/3 of the difference, obtained by subtracting the glass transition point from the melting point of the electric resistance thin film layer, to the glass transition point.
申请公布号 JP2015053353(A) 申请公布日期 2015.03.19
申请号 JP20130184719 申请日期 2013.09.06
申请人 SUMITOMO METAL MINING CO LTD 发明人 ASAKAWA YOSHIYUKI
分类号 H05K3/14;B32B15/08;B32B37/06;C23C14/20;H05K1/03;H05K3/38 主分类号 H05K3/14
代理机构 代理人
主权项
地址