| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can inhibit a chip from moving by flow of a resin from a position before being buried.SOLUTION: A semiconductor device manufacturing method comprises: a process A of preparing a laminate which has a temporary fixing sheet, a semiconductor chip temporarily fixed on the temporary fixing sheet and a wall part projecting upward from a temporary fixing sheet surface so as to surround a temporary fixing region in which the semiconductor chip is temporarily fixed; a process B of preparing an encapsulation sheet having a shape in planar view, which fits in an encapsulation region surrounded by the wall part; and a process C of burying the semiconductor chip in the encapsulation sheet in the encapsulation region to form an encapsulated body in which the semiconductor chip is buried in the encapsulation sheet.</p> |
