发明名称 INK JET HEAD AND WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide an ink jet head capable of preventing a short circuit of wiring electrodes on a wiring board due to aggregated conductive particles in an adhesive agent that bonds a head chip and the wiring board.SOLUTION: An ink jet head includes: a head chip 1 in which a plurality of connection electrodes 15A are formed on the surface; and a wiring board 3 connected electrically with the connection electrodes 15A, in which a plurality of wiring electrodes 33A extending outside of a joint area of the head chip 1 are arranged side by side on the surface. On a surface where the connection electrodes 15A of the head chip 1 are formed, the wiring board 3 is bonded through an adhesive agent containing conductive particles P, and thus an adhesive fillet F by the adhesive agent flowing out from a space between the head chip 1 and the wiring board 3 is formed. On the wiring board 3, a first insulator film 34 is formed so as to cover a portion passing through the adhesive fillet F in the wiring electrodes 33A of the joint area.</p>
申请公布号 JP2015051587(A) 申请公布日期 2015.03.19
申请号 JP20130185641 申请日期 2013.09.06
申请人 KONICA MINOLTA INC 发明人 TAKAMATSU HIKARI
分类号 B41J2/045;B41J2/055;B41J2/16 主分类号 B41J2/045
代理机构 代理人
主权项
地址