Integrated Circuit Device Packages And Methods for Manufacturing Integrated Circuit Device Packages

摘要

An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

主权项

1. An integrated circuit device package comprising:
a flexible substrate including a first wiring for an electrical connection; an integrated circuit device disposed on the substrate, the integrated circuit device including a second wiring for an electrical connection spaced apart from the first wiring; a flexible insulation structure covering the substrate and the integrated circuit device, the flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively; a third wiring disposed in the first opening and the second opening and on the insulation structure, the third wiring electrically connecting the first wiring to the second wiring; and a flexible protection member disposed on the insulation structure to cover the third wiring.