SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package according to the present invention includes a lead frame, a substrate which is attached on the mounting part of the lead frame, a semiconductor die which is attached on the substrate, a first wire group which is composed of a plurality of conductive wires to connect each end of substrate pads formed on the substrate and each end of die pads on the semiconductor die, and a second wire group which is composed of a via which connects at least one ground conductive wire for a ground signal in the first wire group to a ground pad on the lead frame and a plurality of conductive wires which connects the other ends of the substrate pads to each lead on the lead frame.