| 摘要 |
PROBLEM TO BE SOLVED: To make an exposure process and a development process unnecessary to simplify manufacture, and to make an exposure apparatus and a development apparatus unnecessary to reduce a cost of facility.SOLUTION: In a pattern forming method, sputtering film deposition is performed for plural times by using a plurality of masks for sputtering having opening patterns in which a pattern formed on an object surface is divided (S3,S5), patterns formed by a plurality of masks for sputtering are synthesized to form a single pattern. By directly forming patterns onto the object surface with sputtering film deposition, an exposure process and a development process become unnecessary. Moreover, dividing a pattern to be formed on the object surface makes it difficult to occur distortion, misalignment or the like of the masks for sputtering. |
