| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has high reliability for a heat cycle.SOLUTION: A semiconductor device comprises: an insulation layer 5 composed of a resin-based material; a metal wiring pattern 4 which is formed on a surface of the insulation layer 5 and has holes 41; and a semiconductor element 2 having a rear face which is electrically connected with the wiring pattern 4 by a resin-based conductive adhesive 7 and bonded to a surface of the insulation layer 5 by a resin-based conductive adhesive 7 filled in the holes 41. Since temperature dependencies of linear expansion coefficients of the insulation layer 5 composed of the resin-based material and the resin-based conductive adhesive 7 can be approximate, a stress generated at a bonded interface in a heat cycle is decreased and a semiconductor device in which the semiconductor element 2 is hard to peel and which has high reliability for a heat cycle. |
