发明名称 SYSTEM AND METHODS FOR PROCESSING A SUBSTRATE
摘要 According to the present disclosure, a substrate processing apparatus for processing a flexible substrate including a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein, a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber, and a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate is provided. The discharging assembly is configured to generate an electric field for ionizing a processing gas.
申请公布号 US2015079271(A1) 申请公布日期 2015.03.19
申请号 US201114364687 申请日期 2011.12.21
申请人 Hermanns Uwe;Morrison Neil;Stolley Tobias;Hacker Volker 发明人 Hermanns Uwe;Morrison Neil;Stolley Tobias;Hacker Volker
分类号 C23C16/503;C23C16/54;C23C16/52 主分类号 C23C16/503
代理机构 代理人
主权项 1. A substrate processing apparatus for processing a flexible substrate, comprising: a vacuum chamber configured for being evacuated and being configured for having a process gas provided therein; a processing module adapted to process the flexible substrate, wherein the processing module is provided within the vacuum chamber; and, a discharging assembly configured to generate a flow of charged particles to discharge the flexible substrate, wherein the discharging assembly is configured to generate an electrical field for ionizing the processing gas.
地址 Karlstein Am Main DE