发明名称 PACKAGE STRUCTURE OF CRYSTAL OSCILLATOR WITH EMBEDDED THERMISTOR
摘要 A package structure of crystal oscillator with embedded thermistor is disclosed. The package structure comprises a ceramic substrate. A crystal oscillation device is mounted in the accommodation space of the ceramic substrate. A cover is used to seal the accommodation space. At least one thermistor is embedded in the ceramic substrate. A patterned metal interconnection in the ceramic substrate is electrically connected with the crystal oscillation device and the thermistor, respectively. The present invention describes as follows: the thermistor is directly embedded in the ceramic substrate to avoid the short-circuit problem caused by electroplating a thermistor exposed and shorten a distance between the thermistor and the crystal oscillation device. Thus, the thermistor can more precisely sense the operating temperature of the crystal oscillation device to timely compensate frequency drift caused by changing the temperature of the crystal oscillation device.
申请公布号 US2015077190(A1) 申请公布日期 2015.03.19
申请号 US201314104392 申请日期 2013.12.12
申请人 TXC CORPORATION 发明人 CHIANG CHIEN-WEI;YEH TING
分类号 H03B1/02 主分类号 H03B1/02
代理机构 代理人
主权项 1. A package structure of crystal oscillator with embedded thermistor comprising: a substrate having an accommodation space disposed thereon; a patterned metal interconnection distributed in said substrate and on a surface of said substrate within said accommodation space; at least one thermistor embedded in said substrate and electrically connected with said patterned metal interconnection in said substrate; a crystal oscillation device mounted on said substrate within said accommodation space and electrically connected with said patterned metal interconnection; and a cover disposed on said substrate to seal said accommodation space.
地址 Taipei TW